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NXP USA Inc. MC9S08DN60AMLC

MC9S08DN60AMLC


  • Manufacturer: ON SEMICONDUCTOR
  • Chip 1 Group NO: MC9S08DN60AMLC
  • Price:
  • Datasheet: PDF
  • Description: MC9S08DN60AMLC(Kg)
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Details

Tags

Parameters
Program Memory Type FLASH
EEPROM Size 2K x 8
RAM Size 2K x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V
Data Converters A/D 10x12b
Oscillator Type External
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 32-LQFP
Supplier Device Package 32-LQFP (7x7)
Base Product Number MC9S08
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 1,250
Mfr NXP USA Inc.
Series S08
Package Tray
Product Status Obsolete
Core Processor S08
Core Size 8-Bit
Speed 40MHz
Connectivity I²C, LINbus, SCI, SPI
Peripherals LVD, POR, PWM, WDT
Number of I/O 25
Program Memory Size 60KB (60K x 8)
S08 S08 Microcontroller IC 8-Bit 40MHz 60KB (60K x 8) FLASH 32-LQFP (7x7)