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NXP USA Inc. MC9S12DG256BCFU

MC9S12DG256BCFU


  • Manufacturer: ON SEMICONDUCTOR
  • Chip 1 Group NO: MC9S12DG256BCFU
  • Price:
  • Datasheet: PDF
  • Description: MC9S12DG256BCFU(Kg)
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Details

Tags

Parameters
Core Size 16-Bit
Speed 25MHz
Connectivity CANbus, I²C, SCI, SPI
Peripherals PWM, WDT
Number of I/O 59
Program Memory Size 256KB (256K x 8)
Program Memory Type FLASH
EEPROM Size 4K x 8
RAM Size 12K x 8
Voltage - Supply (Vcc/Vdd) 2.35V ~ 5.25V
Data Converters A/D 16x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 80-QFP
Supplier Device Package 80-QFP (14x14)
Base Product Number MC9S12
RoHS Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.31.0001
Standard Package 84
Mfr NXP USA Inc.
Series HCS12
Package Tray
Product Status Obsolete
Core Processor HCS12
HCS12 HCS12 Microcontroller IC 16-Bit 25MHz 256KB (256K x 8) FLASH 80-QFP (14x14)