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NXP USA Inc. MC9S12UF32PB

MC9S12UF32PB


  • Manufacturer: ON SEMICONDUCTOR
  • Chip 1 Group NO: MC9S12UF32PB
  • Price:
  • Datasheet: PDF
  • Description: MC9S12UF32PB(Kg)
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Details

Tags

Parameters
Mfr NXP USA Inc.
Series HCS12
Package Tray
Product Status Obsolete
Core Processor HCS12
Core Size 16-Bit
Speed 30MHz
Connectivity ATA, Compact Flash, EBI/EMI, Memory Card, SCI, SD, Smart Media, USB
Peripherals POR, WDT
Number of I/O 41
Program Memory Size 32KB (32K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 3.5K x 8
Voltage - Supply (Vcc/Vdd) 2.25V ~ 5.5V
Data Converters -
Oscillator Type Internal
Operating Temperature 0°C ~ 70°C (TA)
Mounting Type Surface Mount
Package / Case 64-LQFP
Supplier Device Package 64-LQFP (10x10)
Base Product Number MC9S12
RoHS Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 160
HCS12 HCS12 Microcontroller IC 16-Bit 30MHz 32KB (32K x 8) FLASH 64-LQFP (10x10)