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NXP USA Inc. MC9S12XHZ256CAG

MC9S12XHZ256CAG


  • Manufacturer: ON SEMICONDUCTOR
  • Chip 1 Group NO: MC9S12XHZ256CAG
  • Price: $24.88
  • Datasheet: PDF
  • Description: MC9S12XHZ256CAG(Kg)
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Details

Tags

Parameters
Connectivity CANbus, EBI/EMI, I²C, LINbus, SCI, SPI
Peripherals LCD, Motor control PWM, POR, PWM, WDT
Number of I/O 117
Program Memory Size 256KB (256K x 8)
Program Memory Type FLASH
EEPROM Size 4K x 8
RAM Size 16K x 8
Voltage - Supply (Vcc/Vdd) 2.35V ~ 5.5V
Data Converters A/D 16x8/10b
Oscillator Type External
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 144-LQFP
Supplier Device Package 144-LQFP (20x20)
Base Product Number MC9S12
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Other Names 935322557557
Standard Package 300
Mfr NXP USA Inc.
Series HCS12X
Package Tray
Product Status Not For New Designs
Core Processor HCS12X
Core Size 16-Bit
Speed 80MHz
HCS12X HCS12X Microcontroller IC 16-Bit 80MHz 256KB (256K x 8) FLASH 144-LQFP (20x20)