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NXP USA Inc. MM912JP812AMAF

MM912JP812AMAF


  • Manufacturer: ON SEMICONDUCTOR
  • Chip 1 Group NO: MM912JP812AMAF
  • Price:
  • Datasheet: PDF
  • Description: MM912JP812AMAF(Kg)
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Details

Tags

Parameters
Mfr NXP USA Inc.
Series -
Package Tray
Product Status Obsolete
Digi-Key Programmable Not Verified
Applications Engine Control
Core Processor S12P
Program Memory Type FLASH (128kB)
Controller Series HCS12
RAM Size 6K x 8
Interface CAN, SCI, SPI
Number of I/O 8
Voltage - Supply 4.7V ~ 36V
Operating Temperature -40°C ~ 125°C
Mounting Type Surface Mount
Package / Case 100-LQFP Exposed Pad
Supplier Device Package 100-LQFP-EP (14x14)
Base Product Number MM912
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001
Other Names 935319825557
Standard Package 90