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NXP USA Inc. MMC2001HCAB33B

MMC2001HCAB33B


  • Manufacturer: ON SEMICONDUCTOR
  • Chip 1 Group NO: MMC2001HCAB33B
  • Price:
  • Datasheet: PDF
  • Description: MMC2001HCAB33B(Kg)
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Details

Tags

Parameters
Mfr NXP USA Inc.
Series MCore
Package Tray
Product Status Obsolete
Core Processor M210
Core Size 16/32-Bit
Speed 33MHz
Connectivity EBI/EMI, SPI, UART/USART
Peripherals POR, PWM, WDT
Number of I/O 24
Program Memory Size 256KB (256K x 8)
Program Memory Type ROM
EEPROM Size -
RAM Size 32K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V
Data Converters -
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 144-LQFP
Supplier Device Package 144-LQFP (20x20)
Base Product Number MMC2001
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Other Names 935315771557
Standard Package 300
M210 MCore Microcontroller IC 16/32-Bit 33MHz 256KB (256K x 8) ROM 144-LQFP (20x20)