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NXP USA Inc. MPC755BVT300LE

MPC755BVT300LE


  • Manufacturer: ON SEMICONDUCTOR
  • Chip 1 Group NO: MPC755BVT300LE
  • Price:
  • Datasheet: PDF
  • Description: MPC755BVT300LE(Kg)
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Details

Tags

Parameters
Mfr NXP USA Inc.
Series MPC7xx
Package Tray
Product Status Obsolete
Core Processor PowerPC
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 300MHz
Co-Processors/DSP -
RAM Controllers -
Graphics Acceleration No
Display & Interface Controllers -
Ethernet -
SATA -
USB -
Voltage - I/O 2.5V, 3.3V
Operating Temperature 0°C ~ 105°C (TA)
Security Features -
Mounting Type Surface Mount
Package / Case 360-BBGA, FCBGA
Supplier Device Package 360-FCPBGA (25x25)
Additional Interfaces -
Base Product Number MPC75
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Other Names 935324063557
Standard Package 44
PowerPC Microprocessor IC MPC7xx 1 Core, 32-Bit 300MHz 360-FCPBGA (25x25)