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NXP USA Inc. MPC8555VTALF

MPC8555VTALF


  • Manufacturer: ON SEMICONDUCTOR
  • Chip 1 Group NO: MPC8555VTALF
  • Price:
  • Datasheet: PDF
  • Description: MPC8555VTALF(Kg)
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Details

Tags

Parameters
Security Features -
Mounting Type Surface Mount
Package / Case 783-BBGA, FCBGA
Supplier Device Package 783-FCPBGA (29x29)
Additional Interfaces DUART, I²C, PCI, SPI, TDM, UART
Base Product Number MPC85
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 36
Mfr NXP USA Inc.
Series MPC85xx
Package Tray
Product Status Obsolete
Core Processor PowerPC e500
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 667MHz
Co-Processors/DSP Communications; CPM
RAM Controllers DDR, SDRAM
Graphics Acceleration No
Display & Interface Controllers -
Ethernet 10/100/1000Mbps (2)
SATA -
USB USB 2.0 (1)
Voltage - I/O 2.5V, 3.3V
Operating Temperature 0°C ~ 105°C (TA)
PowerPC e500 Microprocessor IC MPC85xx 1 Core, 32-Bit 667MHz 783-FCPBGA (29x29)