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NXP USA Inc. MPC860ENCZQ50D4

MPC860ENCZQ50D4


  • Manufacturer: ON SEMICONDUCTOR
  • Chip 1 Group NO: MPC860ENCZQ50D4
  • Price:
  • Datasheet: PDF
  • Description: MPC860ENCZQ50D4(Kg)
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Details

Tags

Parameters
Security Features -
Mounting Type Surface Mount
Package / Case 357-BBGA
Supplier Device Package 357-PBGA (25x25)
Additional Interfaces I²C, IrDA, PCMCIA, SPI, TDM, UART/USART
Base Product Number MPC86
RoHS Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A991B4B
HTSUS 8542.31.0001
Other Names 935324117557
Standard Package 44
Mfr NXP USA Inc.
Series MPC8xx
Package Tray
Product Status Obsolete
Core Processor MPC8xx
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 50MHz
Co-Processors/DSP Communications; CPM
RAM Controllers DRAM
Graphics Acceleration No
Display & Interface Controllers -
Ethernet 10Mbps (4)
SATA -
USB -
Voltage - I/O 3.3V
Operating Temperature -40°C ~ 95°C (TA)
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 357-PBGA (25x25)