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NXP USA Inc. MPF5030BMMA4ES
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| Parameters | |
|---|---|
| Mfr | NXP USA Inc. |
| Series | - |
| Package | Tray |
| Product Status | Active |
| Applications | System Basis Chip |
| Current - Supply | - |
| Operating Temperature | -40°C ~ 125°C (TA) |
| Mounting Type | Surface Mount, Wettable Flank |
| Package / Case | 40-VFQFN Exposed Pad |
| Supplier Device Package | 40-HVQFN (6x6) |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Other Names | 568-MPF5030BMMA4ES |
| Standard Package | 490 |
System Basis Chip PMIC 40-HVQFN (6x6)
