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NXP USA Inc. NX3L2G66GM,125

NX3L2G66GM,125


  • Manufacturer: ON SEMICONDUCTOR
  • Chip 1 Group NO: NX3L2G66GM,125
  • Price:
  • Datasheet: PDF
  • Description: NX3L2G66GM,125(Kg)
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Details

Tags

Parameters
Mfr NXP USA Inc.
Series -
Package Tape & Reel (TR)
Product Status Obsolete
Switch Circuit SPST - NO
Multiplexer/Demultiplexer Circuit 1:1
Number of Circuits 2
On-State Resistance (Max) 750mOhm
Channel-to-Channel Matching (ΔRon) 20mOhm
Voltage - Supply, Single (V+) 1.4V ~ 4.3V
Voltage - Supply, Dual (V±) -
Switch Time (Ton, Toff) (Max) 23ns, 8ns
-3db Bandwidth 60MHz
Charge Injection 6pC
Channel Capacitance (CS(off), CD(off)) 35pF
Current - Leakage (IS(off)) (Max) 10nA
Crosstalk -90dB @ 100kHz
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 8-XFQFN Exposed Pad
Supplier Device Package 8-XQFNU (1.6x1.6)
Base Product Number NX3
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001
Standard Package 4,000
2 Circuit IC Switch 1:1 750mOhm 8-XQFNU (1.6x1.6)