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NXP USA Inc. P89LPC952FBD,157

P89LPC952FBD,157


  • Manufacturer: ON SEMICONDUCTOR
  • Chip 1 Group NO: P89LPC952FBD,157
  • Price:
  • Datasheet: PDF
  • Description: P89LPC952FBD,157(Kg)
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Details

Tags

Parameters
Connectivity I²C, SPI, UART/USART
Peripherals Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O 40
Program Memory Size 8KB (8K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 512 x 8
Voltage - Supply (Vcc/Vdd) 2.4V ~ 3.6V
Data Converters A/D 8x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 44-LQFP
Supplier Device Package 44-LQFP (10x10)
Base Product Number P89LPC952
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.31.0001
Standard Package 800
Mfr NXP USA Inc.
Series LPC900
Package Tray
Product Status Obsolete
Core Processor 8051
Core Size 8-Bit
Speed 18MHz
8051 LPC900 Microcontroller IC 8-Bit 18MHz 8KB (8K x 8) FLASH 44-LQFP (10x10)