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NXP USA Inc. TDA8777HL/33/C1,11

TDA8777HL/33/C1,11


  • Manufacturer: ON SEMICONDUCTOR
  • Chip 1 Group NO: TDA8777HL/33/C1,11
  • Price:
  • Datasheet: PDF
  • Description: TDA8777HL/33/C1,11(Kg)
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Details

Tags

Parameters
Mfr NXP USA Inc.
Series -
Package Tape & Reel (TR)
Product Status Obsolete
Digi-Key Programmable Not Verified
Number of Bits 10
Number of D/A Converters 3
Settling Time -
Output Type Current - Unbuffered
Differential Output Yes
Data Interface Parallel
Reference Type Internal
Voltage - Supply, Analog 3V ~ 3.6V
Voltage - Supply, Digital 3V ~ 3.6V
INL/DNL (LSB) ±1.8 (Max), ±0.9 (Max)
Architecture String DAC
Operating Temperature 0°C ~ 70°C
Package / Case 48-LQFP
Supplier Device Package 48-LQFP (7x7)
Mounting Type Surface Mount
Base Product Number TDA877
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001
Standard Package 2,000
10 Bit Digital to Analog Converter 3 48-LQFP (7x7)