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NXP USA Inc. TDF8555J/N2,112
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| Parameters | |
|---|---|
| Mfr | NXP USA Inc. |
| Series | - |
| Package | Tube |
| Product Status | Obsolete |
| Type | Class AB |
| Output Type | 4 Half Bridge |
| Max Output Power x Channels @ Load | 64W x 1 @ 2Ohm; 45W x 2 @ 4Ohm |
| Voltage - Supply | 6V ~ 18V |
| Features | - |
| Mounting Type | Through Hole |
| Operating Temperature | -40°C ~ 105°C (TA) |
| Supplier Device Package | 37-PDBS |
| Package / Case | 37-SSIP Formed Leads |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| REACH Status | REACH Unaffected |
| ECCN | OBSOLETE |
| Other Names | 568-TDF8555J/N2,112 |
| Standard Package | 13 |
Amplifier IC 4 Half Bridge Class AB 37-PDBS
