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NXP USA Inc. XPC8255CVVIFBC

XPC8255CVVIFBC


  • Manufacturer: ON SEMICONDUCTOR
  • Chip 1 Group NO: XPC8255CVVIFBC
  • Price:
  • Datasheet: PDF
  • Description: XPC8255CVVIFBC(Kg)
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Details

Tags

Parameters
Speed 200MHz
Co-Processors/DSP Communications; RISC CPM
RAM Controllers DRAM, SDRAM
Graphics Acceleration No
Display & Interface Controllers -
Ethernet 10/100Mbps (3)
SATA -
USB -
Voltage - I/O 3.3V
Operating Temperature -40°C ~ 105°C (TA)
Security Features -
Mounting Type Surface Mount
Package / Case 480-LBGA Exposed Pad
Supplier Device Package 480-TBGA (37.5x37.5)
Additional Interfaces I²C, SCC, SMC, SPI, UART, USART
Base Product Number XPC82
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A991B4B
HTSUS 8542.31.0001
Standard Package 21
Mfr NXP USA Inc.
Series MPC82xx
Package Tray
Product Status Obsolete
Core Processor PowerPC G2
Number of Cores/Bus Width 1 Core, 32-Bit
PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 200MHz 480-TBGA (37.5x37.5)