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Omron Electronics Inc-EMC Div XR2C-2015
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| Parameters | |
|---|---|
| Mfr | Omron Electronics Inc-EMC Div |
| Series | XR2 |
| Package | Bulk |
| Product Status | Active |
| Type | SIP |
| Number of Positions or Pins (Grid) | 20 (1 x 20) |
| Pitch - Mating | 0.100" (2.54mm) |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 10.0µin (0.25µm) |
| Contact Material - Mating | Beryllium Copper |
| Mounting Type | Through Hole |
| Features | Closed Frame |
| Termination | Solder |
| Pitch - Post | 0.100" (2.54mm) |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Post | 10.0µin (0.25µm) |
| Contact Material - Post | Beryllium Copper |
| Housing Material | Polybutylene Terephthalate (PBT), Glass Filled |
| Operating Temperature | -55°C ~ 125°C |
| Termination Post Length | 0.092" (2.33mm) |
| Material Flammability Rating | UL94 V-0 |
| Current Rating (Amps) | 1 A |
| Contact Resistance | 20mOhm |
| Base Product Number | XR2C |
| RoHS Status | RoHS Compliant |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| ECCN | EAR99 |
| HTSUS | 8536.69.4040 |
| Other Names | XR2C2015 |
| Standard Package | 100 |
20 (1 x 20) Pos SIP Socket Gold Through Hole
