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Renesas Electronics America Inc UPD70F3526GJA9-GAE-X3-G

UPD70F3526GJA9-GAE-X3-G


  • Manufacturer: Alpha & Omega Semiconductor Inc.
  • Chip 1 Group NO: UPD70F3526GJA9-GAE-X3-G
  • Price:
  • Datasheet: PDF
  • Description: UPD70F3526GJA9-GAE-X3-G(Kg)
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Details

Tags

Parameters
Mfr Renesas Electronics America Inc
Series V850E2/Dx4
Package Bulk
Product Status Obsolete
Core Processor V850E2M
Core Size 32-Bit
Speed 120MHz
Connectivity CANbus, EBI/EMI, Ethernet, I²C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals DMA, I²S, LCD, LVD, POR, PWM, WDT
Number of I/O 105
Program Memory Size 3MB (3M x 8)
Program Memory Type FLASH
EEPROM Size 32K x 8
RAM Size 256K x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V
Data Converters A/D 16x10/12b
Oscillator Type Internal
Operating Temperature -40°C ~ 105°C (TA)
Mounting Type Surface Mount
Package / Case 144-LQFP
Supplier Device Package 144-LQFP (20x20)
Base Product Number UPD70F3526
REACH Status REACH Unaffected
ECCN OBSOLETE
Other Names 559-UPD70F3526GJA9-GAE-X3-G
Standard Package 1
V850E2M V850E2/Dx4 Microcontroller IC 32-Bit 120MHz 3MB (3M x 8) FLASH 144-LQFP (20x20)