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Samtec Inc. ESQ-101-23-T-T

ESQ-101-23-T-T


  • Manufacturer: ERP Power, LLC
  • Chip 1 Group NO: ESQ-101-23-T-T
  • Price:
  • Datasheet: PDF
  • Description: ESQ-101-23-T-T(Kg)
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Details

Tags

Parameters
Mfr Samtec Inc.
Series ESQ
Package Bulk
Product Status Active
Connector Type Elevated Socket
Contact Type Forked
Style Board to Board
Number of Positions 3
Number of Positions Loaded All
Pitch - Mating -
Number of Rows 3
Row Spacing - Mating 0.100" (2.54mm)
Mounting Type Through Hole
Termination Solder
Fastening Type Push-Pull
Contact Finish - Mating Tin
Contact Finish Thickness - Mating -
Insulation Color Black
Insulation Height 0.535" (13.60mm)
Contact Length - Post 0.190" (4.83mm)
Operating Temperature -55°C ~ 105°C
Material Flammability Rating UL94 V-0
Contact Finish - Post Tin
Mated Stacking Heights -
Ingress Protection -
Features -
Current Rating (Amps) 5.7A per Contact
Voltage Rating 550VAC
Applications -
Insulation Material Liquid Crystal Polymer (LCP)
Contact Shape Square
Contact Material Phosphor Bronze
Contact Finish Thickness - Post -
Base Product Number ESQ-101
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not Applicable
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040
Standard Package 1
3 Position Elevated Socket Connector Through Hole Tin