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Samtec Inc. ESQ-133-48-S-T

ESQ-133-48-S-T


  • Manufacturer: ERP Power, LLC
  • Chip 1 Group NO: ESQ-133-48-S-T
  • Price:
  • Datasheet: PDF
  • Description: ESQ-133-48-S-T(Kg)
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Details

Tags

Parameters
Mfr Samtec Inc.
Series ESQ
Package Bulk
Product Status Active
Connector Type Elevated Socket
Contact Type Forked
Style Board to Board
Number of Positions 99
Number of Positions Loaded All
Pitch - Mating 0.100" (2.54mm)
Number of Rows 3
Row Spacing - Mating 0.100" (2.54mm)
Mounting Type Through Hole
Termination Solder
Fastening Type Push-Pull
Contact Finish - Mating Gold
Contact Finish Thickness - Mating 30.0µin (0.76µm)
Insulation Color Black
Insulation Height 0.535" (13.60mm)
Contact Length - Post 0.190" (4.83mm)
Operating Temperature -55°C ~ 125°C
Material Flammability Rating UL94 V-0
Contact Finish - Post Tin
Mated Stacking Heights -
Ingress Protection -
Features -
Current Rating (Amps) 5.7A per Contact
Voltage Rating 550VAC
Applications -
Insulation Material Liquid Crystal Polymer (LCP)
Contact Shape Square
Contact Material Phosphor Bronze
Contact Finish Thickness - Post -
Base Product Number ESQ-133
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not Applicable
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040
Standard Package 1
99 Position Elevated Socket Connector 0.100" (2.54mm) Through Hole Gold