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Samtec Inc. ESQT-103-02-L-S-665

ESQT-103-02-L-S-665


  • Manufacturer: ERP Power, LLC
  • Chip 1 Group NO: ESQT-103-02-L-S-665
  • Price:
  • Datasheet: -
  • Description: ESQT-103-02-L-S-665(Kg)
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Details

Tags

Parameters
Series ESQT
Package Bulk
Product Status Active
Connector Type Elevated Socket
Contact Type Forked
Style Board to Board or Cable
Number of Positions 3
Number of Positions Loaded All
Pitch - Mating 0.079" (2.00mm)
Number of Rows 1
Row Spacing - Mating -
Mounting Type Through Hole
Termination Solder
Fastening Type Push-Pull
Contact Finish - Mating Gold
Contact Finish Thickness - Mating 10.0µin (0.25µm)
Insulation Color Black
Insulation Height 0.665" (16.90mm)
Contact Length - Post 0.185" (4.70mm)
Operating Temperature -55°C ~ 125°C
Material Flammability Rating UL94 V-0
Contact Finish - Post Tin
Mated Stacking Heights -
Ingress Protection -
Features -
Current Rating (Amps) 4.5A per Contact
Voltage Rating -
Applications -
Insulation Material Liquid Crystal Polymer (LCP)
Contact Shape Square
Contact Material Phosphor Bronze
Contact Finish Thickness - Post -
Base Product Number ESQT-103
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not Applicable
ECCN EAR99
HTSUS 8536.69.4040
Standard Package 1
Mfr Samtec Inc.
3 Position Elevated Socket Connector 0.079" (2.00mm) Through Hole Gold