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Samtec Inc. ESQT-113-02-L-D-585
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| Parameters | |
|---|---|
| Mfr | Samtec Inc. |
| Series | ESQT |
| Package | Bulk |
| Product Status | Active |
| Connector Type | Elevated Socket |
| Contact Type | Forked |
| Style | Board to Board or Cable |
| Number of Positions | 26 |
| Number of Positions Loaded | All |
| Pitch - Mating | 0.079" (2.00mm) |
| Number of Rows | 2 |
| Row Spacing - Mating | 0.079" (2.00mm) |
| Mounting Type | Through Hole |
| Termination | Solder |
| Fastening Type | Push-Pull |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 10.0µin (0.25µm) |
| Insulation Color | Black |
| Insulation Height | 0.585" (14.86mm) |
| Contact Length - Post | 0.265" (6.73mm) |
| Operating Temperature | -55°C ~ 125°C |
| Material Flammability Rating | UL94 V-0 |
| Contact Finish - Post | Tin |
| Mated Stacking Heights | - |
| Ingress Protection | - |
| Features | - |
| Current Rating (Amps) | 4.5A per Contact |
| Voltage Rating | - |
| Applications | - |
| Insulation Material | Liquid Crystal Polymer (LCP) |
| Contact Shape | Square |
| Contact Material | Phosphor Bronze |
| Contact Finish Thickness - Post | - |
| Base Product Number | ESQT-113 |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| ECCN | EAR99 |
| HTSUS | 8536.69.4040 |
| Standard Package | 1 |
26 Position Elevated Socket Connector 0.079" (2.00mm) Through Hole Gold
