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Samtec Inc. HSEC8-110-01-S-DV-BL
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| Parameters | |
|---|---|
| Termination | Solder |
| Contact Material | Beryllium Copper |
| Contact Finish | Gold |
| Contact Finish Thickness | 30.0µin (0.76µm) |
| Contact Type | Cantilever |
| Color | Black |
| Flange Feature | - |
| Operating Temperature | -55°C ~ 125°C |
| Material - Insulation | Liquid Crystal Polymer (LCP) |
| Base Product Number | HSEC8-110 |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| ECCN | EAR99 |
| HTSUS | 8536.69.4040 |
| Standard Package | 500 |
| Mfr | Samtec Inc. |
| Series | Edge Rate™ HSEC8 |
| Package | Bulk |
| Product Status | Active |
| Card Type | Non Specified - Dual Edge |
| Gender | Female |
| Number of Positions/Bay/Row | 10 |
| Number of Positions | 20 |
| Card Thickness | 0.062" (1.57mm) |
| Number of Rows | 2 |
| Pitch | 0.031" (0.80mm) |
| Read Out | Dual |
| Features | Board Lock |
| Mounting Type | Surface Mount |
20 Position Female Connector Non Specified - Dual Edge Gold 0.031" (0.80mm) Black
