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Samtec Inc. HSEC8-113-01-L-D

HSEC8-113-01-L-D


  • Manufacturer: ERP Power, LLC
  • Chip 1 Group NO: HSEC8-113-01-L-D
  • Price:
  • Datasheet: -
  • Description: HSEC8-113-01-L-D(Kg)
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Details

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Parameters
Number of Positions/Bay/Row 13
Number of Positions 26
Card Thickness 0.062" (1.57mm)
Number of Rows 2
Pitch 0.031" (0.80mm)
Read Out Dual
Features -
Mounting Type Board Edge, Straddle Mount
Termination Solder
Contact Material Beryllium Copper
Contact Finish Gold
Contact Finish Thickness 10.0µin (0.25µm)
Contact Type Cantilever
Color Black
Flange Feature -
Operating Temperature -55°C ~ 125°C
Material - Insulation Liquid Crystal Polymer (LCP)
Base Product Number HSEC8-113
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN EAR99
HTSUS 8536.69.4040
Standard Package 500
Mfr Samtec Inc.
Series Edge Rate™ HSEC8
Package Bulk
Product Status Obsolete
Card Type Non Specified - Dual Edge
Gender Female
26 Position Female Connector Non Specified - Dual Edge Gold 0.031" (0.80mm) Black