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Samtec Inc. HSEC8-190-01-H-DV-A-WT-K

HSEC8-190-01-H-DV-A-WT-K


  • Manufacturer: ERP Power, LLC
  • Chip 1 Group NO: HSEC8-190-01-H-DV-A-WT-K
  • Price:
  • Datasheet: PDF
  • Description: HSEC8-190-01-H-DV-A-WT-K(Kg)
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Details

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Parameters
Number of Positions 180
Card Thickness 0.062" (1.57mm)
Number of Rows 2
Pitch 0.031" (0.80mm)
Read Out Dual
Features Board Guide, Solder Retention
Mounting Type Surface Mount
Termination Solder
Contact Material Beryllium Copper
Contact Finish Gold
Contact Finish Thickness 30.0µin (0.76µm)
Contact Type Cantilever
Color Black
Flange Feature -
Operating Temperature -55°C ~ 125°C
Material - Insulation Liquid Crystal Polymer (LCP)
Base Product Number HSEC8-190
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN EAR99
HTSUS 8536.69.4040
Standard Package 500
Mfr Samtec Inc.
Series Edge Rate™ HSEC8
Package Bulk
Product Status Active
Card Type Non Specified - Dual Edge
Gender Female
Number of Positions/Bay/Row 90
180 Position Female Connector Non Specified - Dual Edge Gold 0.031" (0.80mm) Black