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Samtec Inc. HTSW-115-19-G-D-LL
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| Parameters | |
|---|---|
| Mfr | Samtec Inc. |
| Series | HTSW |
| Package | Bulk |
| Product Status | Active |
| Connector Type | Header |
| Contact Type | Male Pin |
| Pitch - Mating | 0.100" (2.54mm) |
| Number of Positions | 30 |
| Number of Rows | 3 |
| Row Spacing - Mating | 0.100" (2.54mm) |
| Number of Positions Loaded | All |
| Style | Board to Board or Cable |
| Shrouding | Unshrouded |
| Mounting Type | Through Hole |
| Termination | Kinked Pin, Solder |
| Fastening Type | Push-Pull |
| Contact Length - Mating | 0.820" (20.83mm) |
| Contact Length - Post | 0.110" (2.79mm) |
| Overall Contact Length | 1.030" (26.16mm) |
| Insulation Height | 0.100" (2.54mm) |
| Contact Shape | Square |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 10.0µin (0.25µm) |
| Contact Finish - Post | Gold |
| Contact Material | Phosphor Bronze |
| Insulation Material | Liquid Crystal Polymer (LCP) |
| Features | - |
| Operating Temperature | -55°C ~ 125°C |
| Ingress Protection | - |
| Material Flammability Rating | UL94 V-0 |
| Insulation Color | Natural |
| Current Rating (Amps) | Varies by Wire Gauge |
| Voltage Rating | - |
| Mated Stacking Heights | - |
| Contact Finish Thickness - Post | 3.00µin (0.076µm) |
| Applications | - |
| Base Product Number | HTSW-115 |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| ECCN | EAR99 |
| HTSUS | 8536.69.4040 |
| Standard Package | 1 |
Connector Header Through Hole 30 position 0.100" (2.54mm)
