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Samtec Inc. HTSW-115-19-G-D-LL

HTSW-115-19-G-D-LL


  • Manufacturer: ERP Power, LLC
  • Chip 1 Group NO: HTSW-115-19-G-D-LL
  • Price:
  • Datasheet: -
  • Description: HTSW-115-19-G-D-LL(Kg)
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Details

Tags

Parameters
Mfr Samtec Inc.
Series HTSW
Package Bulk
Product Status Active
Connector Type Header
Contact Type Male Pin
Pitch - Mating 0.100" (2.54mm)
Number of Positions 30
Number of Rows 3
Row Spacing - Mating 0.100" (2.54mm)
Number of Positions Loaded All
Style Board to Board or Cable
Shrouding Unshrouded
Mounting Type Through Hole
Termination Kinked Pin, Solder
Fastening Type Push-Pull
Contact Length - Mating 0.820" (20.83mm)
Contact Length - Post 0.110" (2.79mm)
Overall Contact Length 1.030" (26.16mm)
Insulation Height 0.100" (2.54mm)
Contact Shape Square
Contact Finish - Mating Gold
Contact Finish Thickness - Mating 10.0µin (0.25µm)
Contact Finish - Post Gold
Contact Material Phosphor Bronze
Insulation Material Liquid Crystal Polymer (LCP)
Features -
Operating Temperature -55°C ~ 125°C
Ingress Protection -
Material Flammability Rating UL94 V-0
Insulation Color Natural
Current Rating (Amps) Varies by Wire Gauge
Voltage Rating -
Mated Stacking Heights -
Contact Finish Thickness - Post 3.00µin (0.076µm)
Applications -
Base Product Number HTSW-115
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not Applicable
ECCN EAR99
HTSUS 8536.69.4040
Standard Package 1
Connector Header Through Hole 30 position 0.100" (2.54mm)