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Samtec Inc. HTSW-128-25-G-Q

HTSW-128-25-G-Q


  • Manufacturer: ERP Power, LLC
  • Chip 1 Group NO: HTSW-128-25-G-Q
  • Price:
  • Datasheet: -
  • Description: HTSW-128-25-G-Q(Kg)
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Details

Tags

Parameters
Mfr Samtec Inc.
Series HTSW
Package Bulk
Product Status Active
Connector Type Header
Contact Type Male Pin
Pitch - Mating 0.100" (2.54mm)
Number of Positions 84
Number of Rows 3
Row Spacing - Mating 0.100" (2.54mm)
Number of Positions Loaded 56
Style Board to Board or Cable
Shrouding Unshrouded
Mounting Type Through Hole
Termination Solder
Fastening Type Push-Pull
Contact Length - Mating 0.320" (8.13mm)
Contact Length - Post 0.210" (5.33mm)
Overall Contact Length 0.630" (16.00mm)
Insulation Height 0.100" (2.54mm)
Contact Shape Square
Contact Finish - Mating Gold
Contact Finish Thickness - Mating 10.0µin (0.25µm)
Contact Finish - Post Gold
Contact Material Phosphor Bronze
Insulation Material Liquid Crystal Polymer (LCP)
Features -
Operating Temperature -55°C ~ 125°C
Ingress Protection -
Material Flammability Rating UL94 V-0
Insulation Color Natural
Current Rating (Amps) Varies by Wire Gauge
Voltage Rating -
Mated Stacking Heights -
Contact Finish Thickness - Post 3.00µin (0.076µm)
Applications -
Base Product Number HTSW-128
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not Applicable
ECCN EAR99
HTSUS 8536.69.4040
Standard Package 1
Connector Header Through Hole 84 position 0.100" (2.54mm)