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Samtec Inc. TSW-103-08-H-D

TSW-103-08-H-D


  • Manufacturer: ERP Power, LLC
  • Chip 1 Group NO: TSW-103-08-H-D
  • Price: $1.70
  • Datasheet: -
  • Description: TSW-103-08-H-D(Kg)
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Details

Tags

Parameters
Mfr Samtec Inc.
Series TSW
Package Bag
Product Status Active
Connector Type Header
Contact Type Male Pin
Pitch - Mating 0.100" (2.54mm)
Number of Positions 6
Number of Rows 2
Row Spacing - Mating 0.100" (2.54mm)
Number of Positions Loaded All
Style Board to Board or Cable
Shrouding Unshrouded
Mounting Type Through Hole
Termination Solder
Fastening Type Push-Pull
Contact Length - Mating 0.230" (5.84mm)
Contact Length - Post 0.200" (5.08mm)
Overall Contact Length 0.530" (13.46mm)
Insulation Height 0.100" (2.54mm)
Contact Shape Square
Contact Finish - Mating Gold
Contact Finish Thickness - Mating 30.0µin (0.76µm)
Contact Finish - Post Gold
Contact Material Phosphor Bronze
Insulation Material Polybutylene Terephthalate (PBT)
Features -
Operating Temperature -55°C ~ 125°C
Ingress Protection -
Material Flammability Rating UL94 V-0
Insulation Color Black
Current Rating (Amps) -
Voltage Rating -
Mated Stacking Heights -
Contact Finish Thickness - Post 3.00µin (0.076µm)
Applications -
Base Product Number TSW-103
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN EAR99
HTSUS 8536.69.4040
Standard Package 1
Connector Header Through Hole 6 position 0.100" (2.54mm)