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TDK Corporation VLS252010HBX-3R3M-1

VLS252010HBX-3R3M-1


  • Manufacturer: Hoffman Enclosures, Inc.
  • Chip 1 Group NO: VLS252010HBX-3R3M-1
  • Price: $0.35
  • Datasheet: PDF
  • Description: VLS252010HBX-3R3M-1(Kg)
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Details

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Parameters
Supplier Device Package 1008 (2520 Metric)
Size / Dimension 0.098" L x 0.079" W (2.50mm x 2.00mm)
Height - Seated (Max) 0.039" (1.00mm)
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8504.50.4000
Standard Package 2,000
Mfr TDK Corporation
Series VLS-HBX-1
Package Tape & Reel (TR)
Product Status Active
Type Drum Core, Wirewound
Material - Core Metal
Inductance 3.3 µH
Tolerance ±20%
Current Rating (Amps) 1.6 A
Current - Saturation (Isat) 1.26A
Shielding Shielded
DC Resistance (DCR) 178mOhm Max
Q @ Freq -
Frequency - Self Resonant -
Ratings -
Operating Temperature -40°C ~ 105°C
Inductance Frequency - Test 1 MHz
Mounting Type Surface Mount
Package / Case 1008 (2520 Metric)
3.3 µH Shielded Drum Core, Wirewound Inductor 1.6 A 178mOhm Max 1008 (2520 Metric)