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TDK InvenSense MMIC271609T4064C0300
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| Parameters | |
|---|---|
| Mfr | TDK InvenSense |
| Series | MMIC |
| Package | Bulk |
| Product Status | Last Time Buy |
| Type | MEMS (Silicon) |
| Output Type | Analog |
| Direction | - |
| Sensitivity | -38dB ±3dB @ 94dB SPL |
| S/N Ratio | 61.5dB |
| Impedance | 400 Ohms |
| Current - Supply | 90 µA |
| Port Location | Bottom |
| Ratings | - |
| Termination | Solder Pads |
| Size / Dimension | 0.108" L x 0.073" W (2.75mm x 1.85mm) |
| Height (Max) | 0.039" (1.00mm) |
| Shape | Rectangular |
| ECCN | EAR99 |
| HTSUS | 8518.10.8030 |
| Other Names | 1428-MMIC271609T4064C0300 |
| Standard Package | 1 |
Analog Microphone MEMS (Silicon) (-38dB ±3dB @ 94dB SPL) Solder Pads
