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TE Connectivity Aerospace, Defense and Marine 531143-8

531143-8


  • Manufacturer: Cypress Semiconductor
  • Chip 1 Group NO: 531143-8
  • Price:
  • Datasheet: PDF
  • Description: 531143-8(Kg)
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Details

Tags

Parameters
Mfr TE Connectivity Aerospace, Defense and Marine
Series Military, MIL-DTL-55302, 750 Box
Package Bulk
Product Status Active
Connector Type Receptacle
Contact Type Female Socket
Style Board to Board
Number of Positions 80
Number of Positions Loaded All
Pitch - Mating 0.075" (1.91mm)
Number of Rows 2
Row Spacing - Mating 0.125" (3.18mm)
Mounting Type Through Hole
Termination Solder
Fastening Type Push-Pull
Contact Finish - Mating Gold
Contact Finish Thickness - Mating 50.0µin (1.27µm)
Insulation Color Blue
Insulation Height 0.400" (10.16mm)
Contact Length - Post 0.305" (7.75mm)
Operating Temperature -
Material Flammability Rating -
Contact Finish - Post Tin-Lead
Mated Stacking Heights -
Ingress Protection -
Features Mating Guide
Current Rating (Amps) -
Voltage Rating -
Applications -
Insulation Material Diallyl Phthalate (DAP)
Contact Shape Square
Contact Material -
Contact Finish Thickness - Post -
Base Product Number 531143
RoHS Status RoHS Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN EAR99
HTSUS 8536.69.4040
Standard Package 160
80 Position Receptacle Connector 0.075" (1.91mm) Through Hole Gold