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Winbond Electronics W25N512GVEIG
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| Parameters | |
|---|---|
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 8-WDFN Exposed Pad |
| Supplier Device Package | 8-WSON (8x6) |
| Base Product Number | W25N512 |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| REACH Status | REACH Unaffected |
| ECCN | 3A991B1A |
| HTSUS | 8542.32.0071 |
| Other Names | 256-W25N512GVEIG |
| Standard Package | 63 |
| Mfr | Winbond Electronics |
| Series | SpiFlash® |
| Package | Tube |
| Product Status | Active |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND (SLC) |
| Memory Size | 512Mbit |
| Memory Organization | 64M x 8 |
| Memory Interface | SPI - Quad I/O |
| Clock Frequency | 166 MHz |
| Write Cycle Time - Word, Page | 700µs |
| Voltage - Supply | 2.7V ~ 3.6V |
FLASH - NAND (SLC) Memory IC 512Mbit SPI - Quad I/O 166 MHz 8-WSON (8x6)
