Parameters |
Mfr |
Winbond Electronics |
Series |
- |
Package |
Tray |
Product Status |
Not For New Designs |
Memory Type |
Volatile |
Memory Format |
DRAM |
Technology |
SDRAM - Mobile LPDDR4 |
Memory Size |
4Gbit |
Memory Organization |
128M x 32 |
Memory Interface |
LVSTL_11 |
Clock Frequency |
2.133 GHz |
Write Cycle Time - Word, Page |
18ns |
Access Time |
3.5 ns |
Voltage - Supply |
1.06V ~ 1.17V, 1.7V ~ 1.95V |
Operating Temperature |
-40°C ~ 105°C (TC) |
Mounting Type |
Surface Mount |
Package / Case |
200-WFBGA |
Supplier Device Package |
200-WFBGA (10x14.5) |
Base Product Number |
W66CL2 |
RoHS Status |
ROHS3 Compliant |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
REACH Status |
REACH Unaffected |
ECCN |
EAR99 |
HTSUS |
8542.32.0036 |
Other Names |
256-W66CL2NQUAHJ |
Standard Package |
144 |
SDRAM - Mobile LPDDR4 Memory IC 4Gbit LVSTL_11 2.133 GHz 3.5 ns 200-WFBGA (10x14.5)