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XMOS XS1-G02B-FB144-C4

XS1-G02B-FB144-C4


  • Manufacturer: Echelon Corporation
  • Chip 1 Group NO: XS1-G02B-FB144-C4
  • Price:
  • Datasheet: PDF
  • Description: XS1-G02B-FB144-C4(Kg)
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Details

Tags

Parameters
Mfr XMOS
Series XS1
Package Tray
Product Status Obsolete
Core Processor XCore
Core Size 32-Bit Dual-Core
Speed 400MIPS
Connectivity Configurable
Peripherals -
Number of I/O 88
Program Memory Size 128KB (32K x 32)
Program Memory Type SRAM
EEPROM Size -
RAM Size -
Voltage - Supply (Vcc/Vdd) 0.95V ~ 3.6V
Data Converters -
Oscillator Type External
Operating Temperature 0°C ~ 70°C (TA)
Mounting Type Surface Mount
Package / Case 144-LFBGA
Supplier Device Package 144-FBGA (11x11)
Base Product Number XS1-G02
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A001A3
HTSUS 8542.31.0001
Other Names 880-1006
Standard Package 176
XCore XS1 Microcontroller IC 32-Bit Dual-Core 400MIPS 128KB (32K x 32) SRAM 144-FBGA (11x11)